[Sammelthread] Ryzen DDR5 RAM OC Thread

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Letztendlich ja, hab selbst mal ein paar Tests gemacht:
Hi guys, long time no see, done my own researches too with my little fellow X series & 8000+ mems 1:2 scenarios 🤓
As was found slighty improvements just but no real benefits due to tested all mine's raised Neo's mems freqs & put them in mirror, decided to stick with my first shoot 8000C36 GearOFF ... tightest timmings ever & shorter tFAW/WTRL/RDDL's combo 24/16/6/6/2 & tRTP/RDWR/WRRD 12/16/2 PBO full charge TDP 105W in Bios Enabled Limits 142/110/170 and 5,60ghz allcores, happy Merry Chrismas to you all Luxxer's here 🎆
 

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6400 laufen soweit auch (2h anta, 1,5h 1usmus, 30k Karhu), Spannungen haben ich zum 8000er Setup initial erstmal gleich gelassen. SOC musste ich aber auf 1,225V hochdrehen.

Lexar Kit kam gerade auch.
 

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Wenn die TM5 und Prime das bestätigen, wird das mein 24/7 Setting sein... Lediglich VSoc versuche ich noch zu senken.

Screenshot 2024-12-25 000418.png 2024-12-25.png
 
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@Vince96 Das Lexar Kit kam gestern abend vorbeigeflogen und sind auch 5600er mit 48ns. Selbe 6400er Timings laufen auf Anhieb mit 1,47VDD/1,35VDDQ/1,4VDDIO. Weniger als 1,45VDD wirft direkt Fehler.

RGB Software ist dieselbe wie von Gskill, nur anderes Logo drin. Ist also OEM.

RAMMon v3.3 Build: 1000 built with SysInfo v3.0 Build: 2001
PassMark (R) Software
www.passmark.com

============================
Memory settings
============================

Transfer rate: 6400 MT/s
Memory timings: 28-38-38-50
Channel mode: 2

============================
Memory capacity / benchmarks
============================

L1 cache: 80 KB (630.7 GB/s)
L2 cache: 1024 KB (123.8 GB/s)
L3 cache: 98304 KB (145.4 GB/s)
Physical RAM: 31.7 GB (38704 MB/s)
Latency: 41.664 ns

============================
Memory SPD information
============================
Item | Slot #1 | Slot #2 |
---------------------------------------------------------------------------------------------------------------|---------------------------------------------------------|---------------------------------------------------------|-
Ram Type | DDR5 | DDR5 |
Maximum Clock Speed (MHz) | 3200 (XMP) | 3200 (XMP) |
Maximum Transfer Speed (MT/s) | DDR5-6400 | DDR5-6400 |
Maximum Bandwidth (MB/s) | PC5-25600 | PC5-25600 |
Memory Capacity (MB) | 16384 | 16384 |
DIMM Temperature | N/A | N/A |
Jedec Manufacture Name | Lexar Co Limited | Lexar Co Limited |
Search Amazon.com | Search! | Search! |
SPD Revision | 1.0 | 1.0 |
Registered | No | No |
ECC | No | No |
On-Die ECC | Yes | Yes |
DIMM Slot # | 1 | 2 |
Manufactured | Week 40 of Year 2024 | Week 40 of Year 2024 |
Module Part # | LD5EU016G-6400LA | LD5EU016G-6400LA |
Module Revision | 0x0 | 0x0 |
Module Serial # | 6917129A (8a760024406917129a) | 69170537 (8a7600244069170537) |
Module Manufacturing Location | 0 | 0 |
# of Row Addressing Bits | 16 | 16 |
# of Column Addressing Bits | 10 | 10 |
# of Banks | 32 | 32 |
# of Ranks | 1 | 1 |
Device Width in Bits | 8 | 8 |
Bus Width in Bits | 32 | 32 |
Module Voltage | 1.1V | 1.1V |
CAS Latencies Supported | 22 26 28 30 32 36 40 42 46 50 | 22 26 28 30 32 36 40 42 46 50 |
Timings @ Max Frequency (JEDEC) | 46-45-45-90 | 46-45-45-90 |
Maximum frequency (MHz) | 2800 | 2800 |
Maximum Transfer Speed (MT/s) | DDR5-5600 | DDR5-5600 |
Maximum Bandwidth (MB/s) | PC5-22400 | PC5-22400 |
Minimum Clock Cycle Time, tCK (ns) | 0.357 | 0.357 |
Minimum CAS Latency Time, tAA (ns) | 16.000 | 16.000 |
Minimum RAS to CAS Delay, tRCD (ns) | 16.000 | 16.000 |
Minimum Row Precharge Time, tRP (ns) | 16.000 | 16.000 |
Minimum Active to Precharge Time, tRAS (ns) | 32.000 | 32.000 |
Minimum Row Active to Row Active Delay, tRRD (ns) | 0.000 | 0.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 48.000 | 48.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 295.000 | 295.000 |
| | |
DDR5 Specific SPD Attributes | | |
Maximum Clock Cycle Time, tCKmax (ns) | 1.010 | 1.010 |
Write Recovery time (ns) | 30.000 | 30.000 |
Minimum Auto-Refresh to Active/Auto Refresh Command Period, tRFC2 (ns) | 160.000 | 160.000 |
Minimum Auto-Refresh to Active/Auto Refresh Command Period, tRFC4 (ns) | 130.000 | 130.000 |
Minimum Refresh Recovery Delay Time, tRFC1 (ns) | 0.000 | 0.000 |
Minimum Refresh Recovery Delay Time, tRFC2 (ns) | 0.000 | 0.000 |
Minimum Refresh Recovery Delay Time, tRFCsb (ns) | 0.000 | 0.000 |
Module Type | UDIMM | UDIMM |
Module information SPD revision | 1.0 | 1.0 |
SPD present | Yes | Yes |
SPD device type | SPD5118 | SPD5118 |
SPD Manufacturer | Montage Technology Group (Bank: 7, ID: 0x32) | Montage Technology Group (Bank: 7, ID: 0x32) |
PMIC 0 present | Yes | Yes |
PMIC 0 device type | PMIC5100 | PMIC5100 |
PMIC 0 Manufacturer | Global Mixed-mode Technology Inc (Bank: 14, ID: 0x85) | Global Mixed-mode Technology Inc (Bank: 14, ID: 0x85) |
PMIC 1 present | No | No |
PMIC 1 device type | | |
PMIC 1 Manufacturer | | |
PMIC 2 present | No | No |
PMIC 2 device type | | |
PMIC 2 Manufacturer | | |
Thermal Sensor 0 present | No | No |
Thermal Sensor 1 present | No | No |
Thermal Sensor device type | | |
Thermal Sensor Manufacturer | | |
Module Height (mm) | 32 | 32 |
Module Thickness Front (mm) | 2 | 2 |
Module Thickness Back (mm) | 1 | 1 |
Module Reference Card | Raw Card A Rev. 0 | Raw Card A Rev. 0 |
# DRAM Rows | 1 | 1 |
Heat spreader installed | No | No |
Operating Temperature Range | XT (0 to + 95 °C) | XT (0 to + 95 °C) |
Rank Mix | Symmetrical | Symmetrical |
Number of Package Ranks per Channel | 1 | 1 |
Number of Channels per DIMM | 2 | 2 |
Primary bus width per Channel | 32 bits | 32 bits |
Bus width extension per Channel | 0 bits | 0 bits |
DRAM Manufacture ID | 173 | 173 |
DRAM Manufacture Bank | 1 | 1 |
DRAM Manufacture Name | SK Hynix | SK Hynix |
DRAM Stepping | 4.1 | 4.1 |
SDRAM Package Type | Monolithic SDRAM | Monolithic SDRAM |
SDRAM Density Per Die | 16Gb | 16Gb |
SDRAM Bank Groups | 8 | 8 |
SDRAM Banks Per Bank Group | 4 | 4 |
Second SDRAM Package Type | | |
Second SDRAM Density Per Die | | |
Second SDRAM Column Address Bits | | |
Second SDRAM Row Address Bits | | |
Second SDRAM Device Width | | |
Second SDRAM Bank Groups | | |
Second SDRAM Banks Per Bank Group | | |
First SDRAM RFM RAAMMT | 0X (FGR: 0X) | 0X (FGR: 0X) |
First SDRAM RFM RAAIMT | 0 (FGR: 0) | 0 (FGR: 0) |
First SDRAM RFM Required | no | no |
First SDRAM RFM RAA Counter Decrement per REF command | RAAIMT / 2 | RAAIMT / 2 |
Second SDRAM RFM RAAMMT | | |
Second SDRAM RFM RAAIMT | | |
Second SDRAM RFM Required | | |
Second SDRAM RFM RAA Counter Decrement per REF command | | |
First SDRAM ARFM Level A RAAMMT | 0X (FGR: 0X) | 0X (FGR: 0X) |
First SDRAM ARFM Level A RAAIMT | 0 (FGR: 0) | 0 (FGR: 0) |
First SDRAM ARFM Level A supported | no | no |
First SDRAM ARFM Level A RAA Counter Decrement per REF command | RAAIMT / 2 | RAAIMT / 2 |
Second SDRAM ARFM Level A RAAMMT | | |
Second SDRAM ARFM Level A RAAIMT | | |
Second SDRAM ARFM Level A supported | | |
Second SDRAM ARFM Level A RAA Counter Decrement per REF command | | |
First SDRAM ARFM Level B RAAMMT | 0X (FGR: 0X) | 0X (FGR: 0X) |
First SDRAM ARFM Level B RAAIMT | 0 (FGR: 0) | 0 (FGR: 0) |
First SDRAM ARFM Level B supported | no | no |
First SDRAM ARFM Level B RAA Counter Decrement per REF command | RAAIMT / 2 | RAAIMT / 2 |
Second SDRAM ARFM Level B RAAMMT | | |
Second SDRAM ARFM Level B RAAIMT | | |
Second SDRAM ARFM Level B supported | | |
Second SDRAM ARFM Level B RAA Counter Decrement per REF command | | |
First SDRAM ARFM Level C RAAMMT | 0X (FGR: 0X) | 0X (FGR: 0X) |
First SDRAM ARFM Level C RAAIMT | 0 (FGR: 0) | 0 (FGR: 0) |
First SDRAM ARFM Level C supported | no | no |
First SDRAM ARFM Level C RAA Counter Decrement per REF command | RAAIMT / 2 | RAAIMT / 2 |
Second SDRAM ARFM Level C RAAMMT | | |
Second SDRAM ARFM Level C RAAIMT | | |
Second SDRAM ARFM Level C supported | | |
Second SDRAM ARFM Level C RAA Counter Decrement per REF command | | |
sPPR Granularity | bank | bank |
sPPR Undo/Lock | supported | supported |
Burst length 32 | supported | supported |
MBIST/mPPR | supported | supported |
mPPR/hPPR Abort | not supported | not supported |
PASR | supported | supported |
DCA Types Supported | Device supports DCA for 4-phase internal clock(s) | Device supports DCA for 4-phase internal clock(s) |
x4 RMW/ECS Writeback Suppression | supported | supported |
x4 RMW/ECS Writeback Suppression MR selector | MR9 | MR9 |
Bounded Fault | supported | supported |
SDRAM Nominal Voltage, VDDQ | 1.1V | 1.1V |
SDRAM Nominal Voltage, VPP | 1.8V | 1.8V |
Cyclical Redundancy Code (CRC) for Base Configuration | ac73 | ac73 |
| | |
XMP Attributes | | |
XMP version | 3.0 | 3.0 |
PMIC Vendor ID | 0D85 | 0D85 |
Number of PMICs on DIMM | 1 | 1 |
PMIC capabilities | | |
PMIC has capabilities for OC functions | Yes | Yes |
Current PMIC OC is enabled | Yes | Yes |
PMIC voltage default step size | 5mV | 5mV |
OC global reset functions | No | No |
Validation and Certification Capabilities | | |
DIMM is self-certified by DIMM vendor | No | No |
PMIC Component is validated by Intel AVL level | No | No |
XMP revision | 1.2 | 1.2 |
XMP Profile 1 | | |
Profile name | Profile 1 | Profile 1 |
XMP Certified | No | No |
Recommended number of DIMMs per channel | 1 | 1 |
Module VPP voltage | 1.80V | 1.80V |
Module VDD voltage | 1.40V | 1.40V |
Module VDDQ voltage | 1.40V | 1.40V |
Memory Controller voltage | 1.40V | 1.40V |
Clock speed (MHz) | 3200 | 3200 |
Transfer Speed (MT/s) | DDR5-6400 | DDR5-6400 |
Bandwidth (MB/s) | PC5-25600 | PC5-25600 |
Minimum clock cycle time, tCK (ns) | 0.312 | 0.312 |
Supported CAS latencies | 32 | 32 |
Minimum CAS latency time, tAA (ns) | 9.984 | 9.984 |
Minimum RAS to CAS delay time, tRCD (ns) | 11.856 | 11.856 |
Minimum row precharge time, tRP (ns) | 11.856 | 11.856 |
Minimum active to precharge time, tRAS (ns) | 23.712 | 23.712 |
Supported timing at highest clock speed | 32-38-38-76 | 32-38-38-76 |
Minimum Active to Auto-Refresh Delay, tRC (ns) | 35.568 | 35.568 |
Minimum Write Recovery Time, tWR (ns) | 30.000 | 30.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC1 (ns) | 295.000 | 295.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns) | 160.000 | 160.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFCsb (ns) | 130.000 | 130.000 |
Minimum Read to Read Command Delay Time, Same Bank Group, tCCD_L (ns) | 5.000 (8 nCK) | 5.000 (8 nCK) |
Minimum Write to Write Command Delay Time, Same Bank Group, tCCD_L_WR (ns) | 20.000 (32 nCK) | 20.000 (32 nCK) |
Minimum Write to Write Command Delay Time, Second Write not RMW, Same Bank Group, tCCD_L_WR2 (ns) | 10.000 (16 nCK) | 10.000 (16 nCK) |
Minimum Write to Read Command Delay Time, Same Bank Group, tCCD_L_WTR (ns) | 10.000 (16 nCK) | 10.000 (16 nCK) |
Minimum Write to Read Command Delay Time, Different Bank Group, tCCD_S_WTR (ns) | 2.500 (4 nCK) | 2.500 (4 nCK) |
Minimum Active to Active Command Delay Time, Same Bank Group, tRRD_L (ns) | 5.000 (8 nCK) | 5.000 (8 nCK) |
Minimum Read to Precharge Command Delay Time, tRTP (ns) | 7.500 (12 nCK) | 7.500 (12 nCK) |
Minimum Four Activate Window, tFAW (ns) | 11.428 | 11.428 |
Advanced Memory Overclocking Features | | |
Real-Time Memory Frequency Overclocking | Supported | Supported |
Intel Dynamic Memory Boost | Supported | Supported |
System CMD Rate Mode | 2N | 2N |
Vendor Personality Byte | 0x00 | 0x00 |
| | |
EXPO Attributes | | |
EXPO version | 1.1 | 1.1 |
PMIC feature support | | |
PMIC 10 mV step size support | Yes | Yes |
EXPO Profile 1 | | |
DIMMs per channel supported | 1 | 1 |
EXPO Optional Block Support | | |
Block 1 enabled | Yes | Yes |
SDRAM VDD | 1.40V | 1.40V |
SDRAM VDDQ | 1.40V | 1.40V |
SDRAM VPP | 1.80V | 1.80V |
Clock speed (MHz) | 3200 | 3200 |
Transfer Speed (MT/s) | DDR5-6400 | DDR5-6400 |
Bandwidth (MB/s) | PC5-25600 | PC5-25600 |
Minimum clock cycle time, tCK (ns) | 0.312 | 0.312 |
Minimum CAS latency time, tAA (ns) | 9.984 | 9.984 |
Minimum RAS to CAS delay time, tRCD (ns) | 11.856 | 11.856 |
Minimum row precharge time, tRP (ns) | 11.856 | 11.856 |
Minimum active to precharge time, tRAS (ns) | 23.712 | 23.712 |
Supported timing at highest clock speed | 32-38-38-76 | 32-38-38-76 |
Minimum Active to Auto-Refresh Delay, tRC (ns) | 35.568 | 35.568 |
Minimum Write Recovery Time, tWR (ns) | 30.000 | 30.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC1 (ns) | 295.000 | 295.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns) | 160.000 | 160.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFCsb (ns) | 130.000 | 130.000 |
Minimum Active to Active Command Delay Time, Same Bank Group, tRRD_L (ns) | 5.000 | 5.000 |
Minimum Read to Read Command Delay Time, Same Bank Group, tCCD_L (ns) | 5.000 | 5.000 |
Minimum Write to Write Command Delay Time, Same Bank Group, tCCD_L_WR (ns) | 20.000 | 20.000 |
Minimum Write to Write Command Delay Time, Second Write not RMW, Same Bank Group, tCCD_L_WR2 (ns) | 10.000 | 10.000 |
Minimum Four Activate Window, tFAW (ns) | 11.428 | 11.428 |
Minimum Write to Read Command Delay Time, Same Bank Group, tWTR_L (ns) | 10.000 | 10.000 |
Minimum Write to Read Command Delay Time, Different Bank Group, tWTR_S (ns) | 2.500 | 2.500 |
Minimum Read to Precharge Command Delay Time, tRTP (ns) | 7.500 | 7.500 |
 

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Sehr gutes Bin.
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) 48.000

Ich habe "nur" 48,428
 
Mal ne frage wie testet mann am besten ram habe jetzt 4*16gb drin corsair titanium laufen auf Anhieb mit Expo Profile auf 6000 memtest läuft bis jetzt ohne fehler
 
Mal ne frage wie testet mann am besten ram habe jetzt 4*16gb drin corsair titanium laufen auf Anhieb mit Expo Profile auf 6000 memtest läuft bis jetzt ohne fehler
Entweder Karhu bis 10000% (oder 8K% oder 20K% da scheiden sich die geister), Testmem 5 mit Anta777 Extreme oder mit Prime95 Large FFT AVX.
 
Okay werde ich mal testen aber finde 6000mhz bei 4 RAM riegel ist schon gut


So prime95 läuft seit gut 15 Minuten wie lange sollte man denn laufen lassen?
 
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2-3h wären mal ein anfang da passieren erfahrungsgemäß die meisten Fehler auch wegen z.b Temperatur.
 
Wenn alle so ticken würden wie die meisten hier wäre Expo nur ne Randnotiz. A oder M Die und das Binning mehr braucht man nicht zu wissen der Rest wird am lebenden Objekt ermittelt.
 
also denke expo 6000 mit 4*16gb laufen stabil jetzt die tage mal die timings ausloten
Muss sagen das ich mit den corsair dominator titanium Expo 6000 echt zufrieden bin sind echt gute speicher
 
@zwerg-05

hast du mal einen aktuellen ZenTiming Screenshot davon?
 
RFC, evtl. VSoc, REFI... setzt dich bitte mit der Liste von Seite 1 auseinander. Am Anfang vllt. verwirrend, aber ungemein hilfreich. Ich habe meine 7200er Lexar damit stabil ausreizen können und auch das jetzige Adata 48GB Kit läuft nun stabil mit seinem 24/7 Setup.

Screenshot 2024-12-25 141703.png
 
@Vince96 Das Lexar Kit kam gestern abend vorbeigeflogen und sind auch 5600er mit 48ns. Selbe 6400er Timings laufen auf Anhieb mit 1,47VDD/1,35VDDQ/1,4VDDIO. Weniger als 1,45VDD wirft direkt Fehler.

RGB Software ist dieselbe wie von Gskill, nur anderes Logo drin. Ist also OEM.

RAMMon v3.3 Build: 1000 built with SysInfo v3.0 Build: 2001
PassMark (R) Software
www.passmark.com

============================
Memory settings
============================

Transfer rate: 6400 MT/s
Memory timings: 28-38-38-50
Channel mode: 2

============================
Memory capacity / benchmarks
============================

L1 cache: 80 KB (630.7 GB/s)
L2 cache: 1024 KB (123.8 GB/s)
L3 cache: 98304 KB (145.4 GB/s)
Physical RAM: 31.7 GB (38704 MB/s)
Latency: 41.664 ns

============================
Memory SPD information
============================
Item | Slot #1 | Slot #2 |
---------------------------------------------------------------------------------------------------------------|---------------------------------------------------------|---------------------------------------------------------|-
Ram Type | DDR5 | DDR5 |
Maximum Clock Speed (MHz) | 3200 (XMP) | 3200 (XMP) |
Maximum Transfer Speed (MT/s) | DDR5-6400 | DDR5-6400 |
Maximum Bandwidth (MB/s) | PC5-25600 | PC5-25600 |
Memory Capacity (MB) | 16384 | 16384 |
DIMM Temperature | N/A | N/A |
Jedec Manufacture Name | Lexar Co Limited | Lexar Co Limited |
Search Amazon.com | Search! | Search! |
SPD Revision | 1.0 | 1.0 |
Registered | No | No |
ECC | No | No |
On-Die ECC | Yes | Yes |
DIMM Slot # | 1 | 2 |
Manufactured | Week 40 of Year 2024 | Week 40 of Year 2024 |
Module Part # | LD5EU016G-6400LA | LD5EU016G-6400LA |
Module Revision | 0x0 | 0x0 |
Module Serial # | 6917129A (8a760024406917129a) | 69170537 (8a7600244069170537) |
Module Manufacturing Location | 0 | 0 |
# of Row Addressing Bits | 16 | 16 |
# of Column Addressing Bits | 10 | 10 |
# of Banks | 32 | 32 |
# of Ranks | 1 | 1 |
Device Width in Bits | 8 | 8 |
Bus Width in Bits | 32 | 32 |
Module Voltage | 1.1V | 1.1V |
CAS Latencies Supported | 22 26 28 30 32 36 40 42 46 50 | 22 26 28 30 32 36 40 42 46 50 |
Timings @ Max Frequency (JEDEC) | 46-45-45-90 | 46-45-45-90 |
Maximum frequency (MHz) | 2800 | 2800 |
Maximum Transfer Speed (MT/s) | DDR5-5600 | DDR5-5600 |
Maximum Bandwidth (MB/s) | PC5-22400 | PC5-22400 |
Minimum Clock Cycle Time, tCK (ns) | 0.357 | 0.357 |
Minimum CAS Latency Time, tAA (ns) | 16.000 | 16.000 |
Minimum RAS to CAS Delay, tRCD (ns) | 16.000 | 16.000 |
Minimum Row Precharge Time, tRP (ns) | 16.000 | 16.000 |
Minimum Active to Precharge Time, tRAS (ns) | 32.000 | 32.000 |
Minimum Row Active to Row Active Delay, tRRD (ns) | 0.000 | 0.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 48.000 | 48.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 295.000 | 295.000 |
| | |
DDR5 Specific SPD Attributes | | |
Maximum Clock Cycle Time, tCKmax (ns) | 1.010 | 1.010 |
Write Recovery time (ns) | 30.000 | 30.000 |
Minimum Auto-Refresh to Active/Auto Refresh Command Period, tRFC2 (ns) | 160.000 | 160.000 |
Minimum Auto-Refresh to Active/Auto Refresh Command Period, tRFC4 (ns) | 130.000 | 130.000 |
Minimum Refresh Recovery Delay Time, tRFC1 (ns) | 0.000 | 0.000 |
Minimum Refresh Recovery Delay Time, tRFC2 (ns) | 0.000 | 0.000 |
Minimum Refresh Recovery Delay Time, tRFCsb (ns) | 0.000 | 0.000 |
Module Type | UDIMM | UDIMM |
Module information SPD revision | 1.0 | 1.0 |
SPD present | Yes | Yes |
SPD device type | SPD5118 | SPD5118 |
SPD Manufacturer | Montage Technology Group (Bank: 7, ID: 0x32) | Montage Technology Group (Bank: 7, ID: 0x32) |
PMIC 0 present | Yes | Yes |
PMIC 0 device type | PMIC5100 | PMIC5100 |
PMIC 0 Manufacturer | Global Mixed-mode Technology Inc (Bank: 14, ID: 0x85) | Global Mixed-mode Technology Inc (Bank: 14, ID: 0x85) |
PMIC 1 present | No | No |
PMIC 1 device type | | |
PMIC 1 Manufacturer | | |
PMIC 2 present | No | No |
PMIC 2 device type | | |
PMIC 2 Manufacturer | | |
Thermal Sensor 0 present | No | No |
Thermal Sensor 1 present | No | No |
Thermal Sensor device type | | |
Thermal Sensor Manufacturer | | |
Module Height (mm) | 32 | 32 |
Module Thickness Front (mm) | 2 | 2 |
Module Thickness Back (mm) | 1 | 1 |
Module Reference Card | Raw Card A Rev. 0 | Raw Card A Rev. 0 |
# DRAM Rows | 1 | 1 |
Heat spreader installed | No | No |
Operating Temperature Range | XT (0 to + 95 °C) | XT (0 to + 95 °C) |
Rank Mix | Symmetrical | Symmetrical |
Number of Package Ranks per Channel | 1 | 1 |
Number of Channels per DIMM | 2 | 2 |
Primary bus width per Channel | 32 bits | 32 bits |
Bus width extension per Channel | 0 bits | 0 bits |
DRAM Manufacture ID | 173 | 173 |
DRAM Manufacture Bank | 1 | 1 |
DRAM Manufacture Name | SK Hynix | SK Hynix |
DRAM Stepping | 4.1 | 4.1 |
SDRAM Package Type | Monolithic SDRAM | Monolithic SDRAM |
SDRAM Density Per Die | 16Gb | 16Gb |
SDRAM Bank Groups | 8 | 8 |
SDRAM Banks Per Bank Group | 4 | 4 |
Second SDRAM Package Type | | |
Second SDRAM Density Per Die | | |
Second SDRAM Column Address Bits | | |
Second SDRAM Row Address Bits | | |
Second SDRAM Device Width | | |
Second SDRAM Bank Groups | | |
Second SDRAM Banks Per Bank Group | | |
First SDRAM RFM RAAMMT | 0X (FGR: 0X) | 0X (FGR: 0X) |
First SDRAM RFM RAAIMT | 0 (FGR: 0) | 0 (FGR: 0) |
First SDRAM RFM Required | no | no |
First SDRAM RFM RAA Counter Decrement per REF command | RAAIMT / 2 | RAAIMT / 2 |
Second SDRAM RFM RAAMMT | | |
Second SDRAM RFM RAAIMT | | |
Second SDRAM RFM Required | | |
Second SDRAM RFM RAA Counter Decrement per REF command | | |
First SDRAM ARFM Level A RAAMMT | 0X (FGR: 0X) | 0X (FGR: 0X) |
First SDRAM ARFM Level A RAAIMT | 0 (FGR: 0) | 0 (FGR: 0) |
First SDRAM ARFM Level A supported | no | no |
First SDRAM ARFM Level A RAA Counter Decrement per REF command | RAAIMT / 2 | RAAIMT / 2 |
Second SDRAM ARFM Level A RAAMMT | | |
Second SDRAM ARFM Level A RAAIMT | | |
Second SDRAM ARFM Level A supported | | |
Second SDRAM ARFM Level A RAA Counter Decrement per REF command | | |
First SDRAM ARFM Level B RAAMMT | 0X (FGR: 0X) | 0X (FGR: 0X) |
First SDRAM ARFM Level B RAAIMT | 0 (FGR: 0) | 0 (FGR: 0) |
First SDRAM ARFM Level B supported | no | no |
First SDRAM ARFM Level B RAA Counter Decrement per REF command | RAAIMT / 2 | RAAIMT / 2 |
Second SDRAM ARFM Level B RAAMMT | | |
Second SDRAM ARFM Level B RAAIMT | | |
Second SDRAM ARFM Level B supported | | |
Second SDRAM ARFM Level B RAA Counter Decrement per REF command | | |
First SDRAM ARFM Level C RAAMMT | 0X (FGR: 0X) | 0X (FGR: 0X) |
First SDRAM ARFM Level C RAAIMT | 0 (FGR: 0) | 0 (FGR: 0) |
First SDRAM ARFM Level C supported | no | no |
First SDRAM ARFM Level C RAA Counter Decrement per REF command | RAAIMT / 2 | RAAIMT / 2 |
Second SDRAM ARFM Level C RAAMMT | | |
Second SDRAM ARFM Level C RAAIMT | | |
Second SDRAM ARFM Level C supported | | |
Second SDRAM ARFM Level C RAA Counter Decrement per REF command | | |
sPPR Granularity | bank | bank |
sPPR Undo/Lock | supported | supported |
Burst length 32 | supported | supported |
MBIST/mPPR | supported | supported |
mPPR/hPPR Abort | not supported | not supported |
PASR | supported | supported |
DCA Types Supported | Device supports DCA for 4-phase internal clock(s) | Device supports DCA for 4-phase internal clock(s) |
x4 RMW/ECS Writeback Suppression | supported | supported |
x4 RMW/ECS Writeback Suppression MR selector | MR9 | MR9 |
Bounded Fault | supported | supported |
SDRAM Nominal Voltage, VDDQ | 1.1V | 1.1V |
SDRAM Nominal Voltage, VPP | 1.8V | 1.8V |
Cyclical Redundancy Code (CRC) for Base Configuration | ac73 | ac73 |
| | |
XMP Attributes | | |
XMP version | 3.0 | 3.0 |
PMIC Vendor ID | 0D85 | 0D85 |
Number of PMICs on DIMM | 1 | 1 |
PMIC capabilities | | |
PMIC has capabilities for OC functions | Yes | Yes |
Current PMIC OC is enabled | Yes | Yes |
PMIC voltage default step size | 5mV | 5mV |
OC global reset functions | No | No |
Validation and Certification Capabilities | | |
DIMM is self-certified by DIMM vendor | No | No |
PMIC Component is validated by Intel AVL level | No | No |
XMP revision | 1.2 | 1.2 |
XMP Profile 1 | | |
Profile name | Profile 1 | Profile 1 |
XMP Certified | No | No |
Recommended number of DIMMs per channel | 1 | 1 |
Module VPP voltage | 1.80V | 1.80V |
Module VDD voltage | 1.40V | 1.40V |
Module VDDQ voltage | 1.40V | 1.40V |
Memory Controller voltage | 1.40V | 1.40V |
Clock speed (MHz) | 3200 | 3200 |
Transfer Speed (MT/s) | DDR5-6400 | DDR5-6400 |
Bandwidth (MB/s) | PC5-25600 | PC5-25600 |
Minimum clock cycle time, tCK (ns) | 0.312 | 0.312 |
Supported CAS latencies | 32 | 32 |
Minimum CAS latency time, tAA (ns) | 9.984 | 9.984 |
Minimum RAS to CAS delay time, tRCD (ns) | 11.856 | 11.856 |
Minimum row precharge time, tRP (ns) | 11.856 | 11.856 |
Minimum active to precharge time, tRAS (ns) | 23.712 | 23.712 |
Supported timing at highest clock speed | 32-38-38-76 | 32-38-38-76 |
Minimum Active to Auto-Refresh Delay, tRC (ns) | 35.568 | 35.568 |
Minimum Write Recovery Time, tWR (ns) | 30.000 | 30.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC1 (ns) | 295.000 | 295.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns) | 160.000 | 160.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFCsb (ns) | 130.000 | 130.000 |
Minimum Read to Read Command Delay Time, Same Bank Group, tCCD_L (ns) | 5.000 (8 nCK) | 5.000 (8 nCK) |
Minimum Write to Write Command Delay Time, Same Bank Group, tCCD_L_WR (ns) | 20.000 (32 nCK) | 20.000 (32 nCK) |
Minimum Write to Write Command Delay Time, Second Write not RMW, Same Bank Group, tCCD_L_WR2 (ns) | 10.000 (16 nCK) | 10.000 (16 nCK) |
Minimum Write to Read Command Delay Time, Same Bank Group, tCCD_L_WTR (ns) | 10.000 (16 nCK) | 10.000 (16 nCK) |
Minimum Write to Read Command Delay Time, Different Bank Group, tCCD_S_WTR (ns) | 2.500 (4 nCK) | 2.500 (4 nCK) |
Minimum Active to Active Command Delay Time, Same Bank Group, tRRD_L (ns) | 5.000 (8 nCK) | 5.000 (8 nCK) |
Minimum Read to Precharge Command Delay Time, tRTP (ns) | 7.500 (12 nCK) | 7.500 (12 nCK) |
Minimum Four Activate Window, tFAW (ns) | 11.428 | 11.428 |
Advanced Memory Overclocking Features | | |
Real-Time Memory Frequency Overclocking | Supported | Supported |
Intel Dynamic Memory Boost | Supported | Supported |
System CMD Rate Mode | 2N | 2N |
Vendor Personality Byte | 0x00 | 0x00 |
| | |
EXPO Attributes | | |
EXPO version | 1.1 | 1.1 |
PMIC feature support | | |
PMIC 10 mV step size support | Yes | Yes |
EXPO Profile 1 | | |
DIMMs per channel supported | 1 | 1 |
EXPO Optional Block Support | | |
Block 1 enabled | Yes | Yes |
SDRAM VDD | 1.40V | 1.40V |
SDRAM VDDQ | 1.40V | 1.40V |
SDRAM VPP | 1.80V | 1.80V |
Clock speed (MHz) | 3200 | 3200 |
Transfer Speed (MT/s) | DDR5-6400 | DDR5-6400 |
Bandwidth (MB/s) | PC5-25600 | PC5-25600 |
Minimum clock cycle time, tCK (ns) | 0.312 | 0.312 |
Minimum CAS latency time, tAA (ns) | 9.984 | 9.984 |
Minimum RAS to CAS delay time, tRCD (ns) | 11.856 | 11.856 |
Minimum row precharge time, tRP (ns) | 11.856 | 11.856 |
Minimum active to precharge time, tRAS (ns) | 23.712 | 23.712 |
Supported timing at highest clock speed | 32-38-38-76 | 32-38-38-76 |
Minimum Active to Auto-Refresh Delay, tRC (ns) | 35.568 | 35.568 |
Minimum Write Recovery Time, tWR (ns) | 30.000 | 30.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC1 (ns) | 295.000 | 295.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns) | 160.000 | 160.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFCsb (ns) | 130.000 | 130.000 |
Minimum Active to Active Command Delay Time, Same Bank Group, tRRD_L (ns) | 5.000 | 5.000 |
Minimum Read to Read Command Delay Time, Same Bank Group, tCCD_L (ns) | 5.000 | 5.000 |
Minimum Write to Write Command Delay Time, Same Bank Group, tCCD_L_WR (ns) | 20.000 | 20.000 |
Minimum Write to Write Command Delay Time, Second Write not RMW, Same Bank Group, tCCD_L_WR2 (ns) | 10.000 | 10.000 |
Minimum Four Activate Window, tFAW (ns) | 11.428 | 11.428 |
Minimum Write to Read Command Delay Time, Same Bank Group, tWTR_L (ns) | 10.000 | 10.000 |
Minimum Write to Read Command Delay Time, Different Bank Group, tWTR_S (ns) | 2.500 | 2.500 |
Minimum Read to Precharge Command Delay Time, tRTP (ns) | 7.500 | 7.500 |
Bei Lexar weiß man halt nicht was man bekommt. Manchmal 4800er oder 5600er.

Jedes Kit verhält sich anders. Das Lexar Kit braucht am 7950x3D etwa 0,3V mehr VDD als auf dem 7800x3D.
Die 5600B sind glaub immer Class V A-Die
 
Ich Blick da nicht durch habe ne Latenz vo 150ns das kann doch nicht sein
 

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Bei Lexar weiß man halt nicht was man bekommt. Manchmal 4800er oder 5600er.

Jedes Kit verhält sich anders. Das Lexar Kit braucht am 7950x3D etwa 0,3V mehr VDD als auf dem 7800x3D.
Die 5600B sind glaub immer Class V A-Die
Das jetzt ist von Amazon und war jetzt für 125 absolut fair. Und fairerweise sind die Heatspreader bei Gskill auch sehr flimsig, also von der Verarbeitung ist das relativ ähnlich. Hatte mittelfristig aber eh vor auf icemancooler heatspreader zu wechseln bzw in die Wakü einzubinden...

Ein paar schnelle Tests haben aber zumindest ergeben, dass 8000 irgendwie nicht mehr gehen, auch mit stärkerer VDIMM etc nicht mehr. Muss ich mir nochmal in Ruhe anschauen. Dafür gehen die 6400 jetzt mit TRRDL mit 12, da war bei den Gskill bei 15 Schluss und procODT habe ich auch wieder mit 48Ohm bzw dann Auto am Laufen, die Gskill brauchten da ja 60.
 

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Ich Blick da nicht durch habe ne Latenz vo 150ns das kann doch nicht sein
das ist ziemlich strange ^^ EXPO ist nie besonders effizient, aber 150ns hab ich auch noch nicht gesehen...

ist dein Windows total zugemüllt? RGB Software und hunderte Programme im Autostart?

PS im BIOS gibt es auch immer eine Screenshot Funktion - diese bitte auch nutzen
 
hatte heute dieses firmware update gemacht
[ ASUS ][ USB4 PCIE GEN4 CARD ] PD Firmware Version 110_Windows_Update Tool 1

Version 110
3.09 MB 2024/12/17
SHA-256 :934D5D16D82365A1930B2D8D7451B53E95BFDBF1C3F24814780CC9C5EF5865A6
SHA256 :
934d5d16d82365a1930b2d8d7451b53e95bfdbf1c3f24814780cc9c5ef5865a6
Features :
1. Update Firmware for USB PCIE GEN4 CARD
2. Update Thunderbolt/USB4 device compatibility
3. Update Monitor compatibility

jetzt wieder auf ne alte zurück nun wieder bei 71ns

so siehts jetzt wieder aus lag definitiv an dieser firmware von asus


neu.png
 
ja gut, das hatte @lordberti in dem AM5 AGESA Thread ja auch schon geschrieben ^^
 
71ns ist trotzdem viel zu hoch für einen 7900 da musste was machen 8-)
 
Das jetzt ist von Amazon und war jetzt für 125 absolut fair. Und fairerweise sind die Heatspreader bei Gskill auch sehr flimsig, also von der Verarbeitung ist das relativ ähnlich. Hatte mittelfristig aber eh vor auf icemancooler heatspreader zu wechseln bzw in die Wakü einzubinden...

Ein paar schnelle Tests haben aber zumindest ergeben, dass 8000 irgendwie nicht mehr gehen, auch mit stärkerer VDIMM etc nicht mehr. Muss ich mir nochmal in Ruhe anschauen. Dafür gehen die 6400 jetzt mit TRRDL mit 12, da war bei den Gskill bei 15 Schluss und procODT habe ich auch wieder mit 48Ohm bzw dann Auto am Laufen, die Gskill brauchten da ja 60.
8000 gehen easy. Mein 8000er Gskill Kit ist auch nicht besser als ein Random 6000er Kit.
 
ja aber was verstehe diese tabelle einfach nicht und 71 ist umwelten besser als 144 :)

was soll ich dort am besten anfangen zu ändern wäre um hilfe echt froh


IMG_20241225_172528.jpg
 
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